Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

Hui Tang; Arunkumar H. Venkateshaiah; John F. Dawson; Andy Marvin; Martin Robinson; Jie Ge

Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

Hui Tang, Arunkumar H. Venkateshaiah, John F. Dawson, Andy Marvin, Martin Robinson, Jie Ge

Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.

Original language	English
Title of host publication	Joint IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity and EMC Europe
Number of pages	6
Publication status	Accepted/In press - 4 May 2021

Bibliographical note

Submitted 16/03/21, Accepted 4/5/2021

Keywords

EMC
EMI
Electromagnetic Susceptibility
Absorption cross section

Access to Document

EMC_Europe_2021_V23_JFD_postprint
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Accepted author manuscript, 2.35 MB

1 Finished

PETER: PETER: Pan-European Training, research and education network on Electromagnetic Risk Management
Dawson, J. F. (Principal investigator), Kelly, T. (Co-investigator) & Trefzer, M. A. (Co-investigator)
EUROPEAN COMMISSION
1/04/19 → 30/09/23
Project: Research project (funded) › Research

Cite this

@inproceedings{0252e6659672427e93328b090ac44a33,

title = "Analysis and Estimation of Electromagnetic Energy Coupled into IC packages",

abstract = "Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.",

keywords = "EMC, EMI, Electromagnetic Susceptibility, Absorption cross section",

author = "Hui Tang and Venkateshaiah, {Arunkumar H.} and Dawson, {John F.} and Andy Marvin and Martin Robinson and Jie Ge",

note = "Submitted 16/03/21, Accepted 4/5/2021",

year = "2021",

month = may,

day = "4",

language = "English",

booktitle = "Joint IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity and EMC Europe",

}

TY - GEN

T1 - Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

AU - Tang, Hui

AU - Venkateshaiah, Arunkumar H.

AU - Dawson, John F.

AU - Marvin, Andy

AU - Robinson, Martin

AU - Ge, Jie

N1 - Submitted 16/03/21, Accepted 4/5/2021

PY - 2021/5/4

Y1 - 2021/5/4

N2 - Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.

AB - Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.

KW - EMC

KW - EMI

KW - Electromagnetic Susceptibility

KW - Absorption cross section

M3 - Conference contribution

BT - Joint IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity and EMC Europe

ER -

Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

Abstract

Bibliographical note

Keywords

Access to Document

Projects

PETER: PETER: Pan-European Training, research and education network on Electromagnetic Risk Management

Cite this