Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.
Original languageEnglish
Title of host publicationJoint IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity and EMC Europe
Number of pages6
Publication statusAccepted/In press - 4 May 2021

Bibliographical note

Submitted 16/03/21, Accepted 4/5/2021


  • EMC
  • EMI
  • Electromagnetic Susceptibility
  • Absorption cross section

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