Electromagnetic Monitoring of Semiconductor Ageing

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)98 - 102
JournalProcedia CIRP
Volume22
DOIs
Publication statusPublished - 2014
Event3rd International Conference in Through-life Engineering Services - , United Kingdom
Duration: 4 Nov 20135 Nov 2013

Bibliographical note

© Published by Elsevier BV 2014. This content is made available by the publisher under a Creative Commons CC BY-NC-ND Licence. Issue title: Proceedings of the 3rd International Conference in Through-life Engineering Services

Keywords

  • Intermodulation
  • Electromagnetic Compatibility
  • Semiconductor Ageing
  • Failure prediction
  • Through life monitoring

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