Abstract
For the first time, we demonstrate, using an atomistic description of a 30nm diameter spin-transfer-torque magnetic random access memories (STT-MRAM), that the difference in mechanical properties of its sub-nanometer layers induces a high compressive strain in the magnetic tunnel junction (MTJ) and leads to a detrimental magnetostrictive effect. Our model explains the issues met in engineering the electrical and magnetic performances in scaled STT-MRAM devices. The resulting high compressive strain built in the stack, particularly in the MgO tunnel barrier (t-MgO), and its associated non-uniform atomic displacements, impacts on the quality of the MTJ interface and leads to strain relieve mechanisms such as surface roughness and adhesion issues. We illustrate that the strain gradient induced by the different materials and their thicknesses in the stacks has a negative impact on the tunnel magneto-resistance (TMR), on the magnetic nucleation process and on the STT-MRAM performance.
Original language | English |
---|---|
Title of host publication | 2018 IEEE International Electron Devices Meeting, IEDM 2018 |
Publisher | IEEE |
Pages | 40.5.1-40.5.4 |
Number of pages | 4 |
Volume | 2018-December |
ISBN (Electronic) | 9781728119878 |
DOIs | |
Publication status | Published - 16 Jan 2019 |
Event | 64th Annual IEEE International Electron Devices Meeting, IEDM 2018 - San Francisco, United States Duration: 1 Dec 2018 → 5 Dec 2018 |
Conference
Conference | 64th Annual IEEE International Electron Devices Meeting, IEDM 2018 |
---|---|
Country/Territory | United States |
City | San Francisco |
Period | 1/12/18 → 5/12/18 |