Fabrication of micro-field emitters on ceramic substrates

Research output: Contribution to journalArticlepeer-review

Abstract

The Field Emission Display (FED) is one of the most promising flat panel displays for the future. Currently this has been demonstrated using Very Large Scale Integrated circuit (VLSI) thin film technology to manufacture the key component of the FED, which is the Spindt type molybdenum micro-cone-shape field emitters. These are normally produced on glass or silicon substrates. In this paper, a new approach has been successfully developed to fabricate micro-field emitters on ceramic substrates. The significance of this development is that it provides the possibility to integrate small size FEDs into large dimensions. (c) 2006 Published by Elsevier B.V.

Original languageEnglish
Pages (from-to)95-100
Number of pages6
JournalMicroelectronic Engineering
Volume84
Issue number1
DOIs
Publication statusPublished - Jan 2007

Keywords

  • FED
  • Spindt type field emitter
  • emission current
  • life time
  • Fowler-Nordheim
  • EMISSION DISPLAYS
  • VACUUM MICROELECTRONICS

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