Fabrication of micro-field emitters on ceramic substrates

L. Chen; M. M. El-Gomati

doi:10.1016/j.mee.2006.08.007

Fabrication of micro-field emitters on ceramic substrates

L. Chen, M. M. El-Gomati

Electronic Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

The Field Emission Display (FED) is one of the most promising flat panel displays for the future. Currently this has been demonstrated using Very Large Scale Integrated circuit (VLSI) thin film technology to manufacture the key component of the FED, which is the Spindt type molybdenum micro-cone-shape field emitters. These are normally produced on glass or silicon substrates. In this paper, a new approach has been successfully developed to fabricate micro-field emitters on ceramic substrates. The significance of this development is that it provides the possibility to integrate small size FEDs into large dimensions. (c) 2006 Published by Elsevier B.V.

Original language	English
Pages (from-to)	95-100
Number of pages	6
Journal	Microelectronic Engineering
Volume	84
Issue number	1
DOIs	https://doi.org/10.1016/j.mee.2006.08.007
Publication status	Published - Jan 2007

Keywords

FED
Spindt type field emitter
emission current
life time
Fowler-Nordheim
EMISSION DISPLAYS
VACUUM MICROELECTRONICS

Access to Document

10.1016/j.mee.2006.08.007

Cite this

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title = "Fabrication of micro-field emitters on ceramic substrates",

abstract = "The Field Emission Display (FED) is one of the most promising flat panel displays for the future. Currently this has been demonstrated using Very Large Scale Integrated circuit (VLSI) thin film technology to manufacture the key component of the FED, which is the Spindt type molybdenum micro-cone-shape field emitters. These are normally produced on glass or silicon substrates. In this paper, a new approach has been successfully developed to fabricate micro-field emitters on ceramic substrates. The significance of this development is that it provides the possibility to integrate small size FEDs into large dimensions. (c) 2006 Published by Elsevier B.V.",

keywords = "FED, Spindt type field emitter, emission current, life time, Fowler-Nordheim, EMISSION DISPLAYS, VACUUM MICROELECTRONICS",

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year = "2007",

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AU - Chen, L.

AU - El-Gomati, M. M.

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AB - The Field Emission Display (FED) is one of the most promising flat panel displays for the future. Currently this has been demonstrated using Very Large Scale Integrated circuit (VLSI) thin film technology to manufacture the key component of the FED, which is the Spindt type molybdenum micro-cone-shape field emitters. These are normally produced on glass or silicon substrates. In this paper, a new approach has been successfully developed to fabricate micro-field emitters on ceramic substrates. The significance of this development is that it provides the possibility to integrate small size FEDs into large dimensions. (c) 2006 Published by Elsevier B.V.

KW - FED

KW - Spindt type field emitter

KW - emission current

KW - life time

KW - Fowler-Nordheim

KW - EMISSION DISPLAYS

KW - VACUUM MICROELECTRONICS

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DO - 10.1016/j.mee.2006.08.007

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VL - 84

SP - 95

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JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 0167-9317

IS - 1

ER -