IEEE Std 2716™-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding

Davy Pissoort; John Frederick Dawson; Yoeri Arien; Colin Brench; Johan Catrysse; Alistair Duffy; Gary Fenical; Dominic Haerke; David Inman; Frank Leferink; Valter  Mariani Primiani; Andy Marvin; Franco Moglie; Michael Oliver; Cornelia Reschka; Jamil Shafi; Brian She; Kyunghwan Song; Adrian Suarez Zapata; Robert Vogt-Ardatjew

doi:10.1109/IEEESTD.2023.10136540

IEEE Std 2716™-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding

Davy Pissoort, John Frederick Dawson, Yoeri Arien, Colin Brench, Johan Catrysse, Alistair Duffy, Gary Fenical, Dominic Haerke, David Inman, Frank Leferink, Valter Mariani Primiani, Andy Marvin, Franco Moglie, Michael Oliver, Cornelia Reschka, Jamil Shafi, Brian She, Kyunghwan Song, Adrian Suarez Zapata, Robert Vogt-Ardatjew

Electronic Engineering

Research output: Other contribution

Abstract

Appropriate methods for the characterization of shielding effectiveness of the board level shields themselves as well as the way they are mounted on the printed circuit board are provided to manufacturers and users of broad level shielding in this guide. A guide for the user in the selection of the appropriate test method in order to determine the level of shielding provided in the intended application will be provided in this guide.

Original language	English
Type	IEEE standard
Publisher	IEEE
Number of pages	46
ISBN (Print)	978-1-5044-9443-4
ISBN (Electronic)	978-1-5044-9442-7
DOIs	https://doi.org/10.1109/IEEESTD.2023.10136540
Publication status	Published - 29 May 2023

Keywords

Electromagnetic shielding
Board level shielding
Electromagnetic Compatibility

Access to Document

10.1109/IEEESTD.2023.10136540

1 Working group

IEEE Standards Association (External organisation)
John Frederick Dawson (Member)
16 May 2016 → 31 Dec 2023
Activity: Membership › Working group

Cite this

Pissoort, D., Dawson, J. F., Arien, Y., Brench, C., Catrysse, J., Duffy, A., Fenical, G., Haerke, D., Inman, D., Leferink, F., Mariani Primiani, V., Marvin, A., Moglie, F., Oliver, M., Reschka, C., Shafi, J., She, B., Song, K., Suarez Zapata, A., & Vogt-Ardatjew, R. (2023, May 29). IEEE Std 2716™-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding. IEEE. https://doi.org/10.1109/IEEESTD.2023.10136540

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title = "IEEE Std 2716{\texttrademark}-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding",

abstract = "Appropriate methods for the characterization of shielding effectiveness of the board level shields themselves as well as the way they are mounted on the printed circuit board are provided to manufacturers and users of broad level shielding in this guide. A guide for the user in the selection of the appropriate test method in order to determine the level of shielding provided in the intended application will be provided in this guide.",

keywords = "Electromagnetic shielding, Board level shielding, Electromagnetic Compatibility",

author = "Davy Pissoort and Dawson, {John Frederick} and Yoeri Arien and Colin Brench and Johan Catrysse and Alistair Duffy and Gary Fenical and Dominic Haerke and David Inman and Frank Leferink and {Mariani Primiani}, Valter and Andy Marvin and Franco Moglie and Michael Oliver and Cornelia Reschka and Jamil Shafi and Brian She and Kyunghwan Song and {Suarez Zapata}, Adrian and Robert Vogt-Ardatjew",

year = "2023",

month = may,

day = "29",

doi = "10.1109/IEEESTD.2023.10136540",

language = "English",

isbn = "978-1-5044-9443-4",

publisher = "IEEE",

address = "United States",

type = "Other",

}

Pissoort, D, Dawson, JF, Arien, Y, Brench, C, Catrysse, J, Duffy, A, Fenical, G, Haerke, D, Inman, D, Leferink, F, Mariani Primiani, V, Marvin, A, Moglie, F, Oliver, M, Reschka, C, Shafi, J, She, B, Song, K, Suarez Zapata, A & Vogt-Ardatjew, R 2023, IEEE Std 2716™-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding. IEEE. https://doi.org/10.1109/IEEESTD.2023.10136540

TY - GEN

T1 - IEEE Std 2716™-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding

AU - Pissoort, Davy

AU - Dawson, John Frederick

AU - Arien, Yoeri

AU - Brench, Colin

AU - Catrysse, Johan

AU - Duffy, Alistair

AU - Fenical, Gary

AU - Haerke, Dominic

AU - Inman, David

AU - Leferink, Frank

AU - Mariani Primiani, Valter

AU - Marvin, Andy

AU - Moglie, Franco

AU - Oliver, Michael

AU - Reschka, Cornelia

AU - Shafi, Jamil

AU - She, Brian

AU - Song, Kyunghwan

AU - Suarez Zapata, Adrian

AU - Vogt-Ardatjew, Robert

PY - 2023/5/29

Y1 - 2023/5/29

N2 - Appropriate methods for the characterization of shielding effectiveness of the board level shields themselves as well as the way they are mounted on the printed circuit board are provided to manufacturers and users of broad level shielding in this guide. A guide for the user in the selection of the appropriate test method in order to determine the level of shielding provided in the intended application will be provided in this guide.

AB - Appropriate methods for the characterization of shielding effectiveness of the board level shields themselves as well as the way they are mounted on the printed circuit board are provided to manufacturers and users of broad level shielding in this guide. A guide for the user in the selection of the appropriate test method in order to determine the level of shielding provided in the intended application will be provided in this guide.

KW - Electromagnetic shielding

KW - Board level shielding

KW - Electromagnetic Compatibility

U2 - 10.1109/IEEESTD.2023.10136540

DO - 10.1109/IEEESTD.2023.10136540

M3 - Other contribution

SN - 978-1-5044-9443-4

PB - IEEE

ER -

IEEE Std 2716™-2022 - Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding

Abstract

Keywords

Access to Document

Activities

IEEE Standards Association (External organisation)

Cite this