Investigating Novel 3D Modular Schemes for Large Array Topologies: Power Modeling and Prototype Feasibility.

Christopher Crispin-Bailey, Jim Austin, Anthony Moulds, Pakon Thuphairo

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents the Tiled Computing Array (TCA), a simple, uniform, 3D-mesh packaging at inter-board level, for massively parallel computers. In particular, the power modelling and practical feasibility of the system is examined. TCA eliminates the need for hierarchical rackmount-structures and introduces short and immediate data channels in multiple physical orientations, allowing a more direct physical mapping of 3D computational topology to real hardware. A dedicated simulation platform has been developed, and an engineered prototype demonstrator has been built. This paper explores the feasibility of the TCA concept for current hardware technologies and systems, evaluates power modeling and validation, and highlights some of the novel design challenges associated with such a system. Evaluations of physical scalability toward large-scale systems are reported, showing that TCA is a promising approach.
Original languageEnglish
Title of host publicationEuromicro DSD 2022 Conference proceedings (TBC)
Number of pages8
Publication statusPublished - 16 Jul 2022
Event25th Euromicro Conference on Digital System Design (DSD), 2022 - Maspalomas, Gran Canaria, Spain, Maspalomas, Spain
Duration: 31 Aug 20222 Sept 2022


Conference25th Euromicro Conference on Digital System Design (DSD), 2022
Abbreviated titleDSD2022
Internet address

Bibliographical note

Jim Austin is a retired Professor of Computing, University of York, UK.


  • computing array
  • interconnection network
  • massively parallel computers
  • scalability
  • simulation

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