Investigating Novel 3D Modular Schemes for Large Array Topologies: Power Modeling and Prototype Feasibility.

TY - GEN

T1 - Investigating Novel 3D Modular Schemes for Large Array Topologies

T2 - 25th Euromicro Conference on Digital System Design (DSD), 2022

AU - Crispin-Bailey, Christopher

AU - Austin, Jim

AU - Moulds, Anthony

AU - Thuphairo, Pakon

N1 - Jim Austin is a retired Professor of Computing, University of York, UK.

PY - 2022/7/16

Y1 - 2022/7/16

N2 - This paper presents the Tiled Computing Array (TCA), a simple, uniform, 3D-mesh packaging at inter-board level, for massively parallel computers. In particular, the power modelling and practical feasibility of the system is examined. TCA eliminates the need for hierarchical rackmount-structures and introduces short and immediate data channels in multiple physical orientations, allowing a more direct physical mapping of 3D computational topology to real hardware. A dedicated simulation platform has been developed, and an engineered prototype demonstrator has been built. This paper explores the feasibility of the TCA concept for current hardware technologies and systems, evaluates power modeling and validation, and highlights some of the novel design challenges associated with such a system. Evaluations of physical scalability toward large-scale systems are reported, showing that TCA is a promising approach.

AB - This paper presents the Tiled Computing Array (TCA), a simple, uniform, 3D-mesh packaging at inter-board level, for massively parallel computers. In particular, the power modelling and practical feasibility of the system is examined. TCA eliminates the need for hierarchical rackmount-structures and introduces short and immediate data channels in multiple physical orientations, allowing a more direct physical mapping of 3D computational topology to real hardware. A dedicated simulation platform has been developed, and an engineered prototype demonstrator has been built. This paper explores the feasibility of the TCA concept for current hardware technologies and systems, evaluates power modeling and validation, and highlights some of the novel design challenges associated with such a system. Evaluations of physical scalability toward large-scale systems are reported, showing that TCA is a promising approach.

KW - computing array

KW - interconnection network

KW - massively parallel computers

KW - scalability

KW - simulation

U2 - 10.1109/DSD57027.2022.00044

DO - 10.1109/DSD57027.2022.00044

M3 - Conference contribution

BT - Euromicro DSD 2022 Conference proceedings (TBC)

PB - IEEE

Y2 - 31 August 2022 through 2 September 2022

ER -