On advantages and limitations of 3D wireless grids as parallel platforms

Christopher Crispin-Bailey; Amir Mansoor Kamali Sarvestani; James Austin

On advantages and limitations of 3D wireless grids as parallel platforms

Christopher Crispin-Bailey, Amir Mansoor Kamali Sarvestani, James Austin

Computer Science

Research output: Contribution to conference › Paper › peer-review

Abstract

To date, in computing technology, wireless connections have not been good choices for connecting processors in a massively parallel system. This is mainly because wireless devices are considered to have both more energy demands and have lower data communication rates compared to their wireline counterparts. In light of developments in wireless technologies in the last decade, this paper investigates if (and, to what extent) that assumption is still valid. Capacitive coupling, inductive coupling and radio waves are reviewed. These technologies are compared with each other as well as with wireline technologies based on factors including data rate, energy consumption and occupied area. We survey the current trends and emerging technology and consider how they can be exploited. For an evaluation case we simulate a 3D wireless parallel platform. This model is the basis for our research to test the viability of a concept 3D wireless interconnect network for a massively parallel computer.

Original language	English
Pages	48-55
Number of pages	8
Publication status	Published - 2013
Event	2013 International Conference on Selected Topics in. IEEE - , Canada Duration: 19 Mar 2013 → …

Conference

Conference	2013 International Conference on Selected Topics in. IEEE
Country/Territory	Canada
Period	19/03/13 → …

Access to Document

http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6613796

1 Active

Cool Computer: Cool Computer
Austin, J. & Crispin-Bailey, C.
1/01/00 → …
Project: Other project › Research collaboration

Cite this

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title = "On advantages and limitations of 3D wireless grids as parallel platforms",

abstract = "To date, in computing technology, wireless connections have not been good choices for connecting processors in a massively parallel system. This is mainly because wireless devices are considered to have both more energy demands and have lower data communication rates compared to their wireline counterparts. In light of developments in wireless technologies in the last decade, this paper investigates if (and, to what extent) that assumption is still valid. Capacitive coupling, inductive coupling and radio waves are reviewed. These technologies are compared with each other as well as with wireline technologies based on factors including data rate, energy consumption and occupied area. We survey the current trends and emerging technology and consider how they can be exploited. For an evaluation case we simulate a 3D wireless parallel platform. This model is the basis for our research to test the viability of a concept 3D wireless interconnect network for a massively parallel computer.",

author = "Christopher Crispin-Bailey and {Kamali Sarvestani}, {Amir Mansoor} and James Austin",

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AU - Kamali Sarvestani, Amir Mansoor

AU - Austin, James

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N2 - To date, in computing technology, wireless connections have not been good choices for connecting processors in a massively parallel system. This is mainly because wireless devices are considered to have both more energy demands and have lower data communication rates compared to their wireline counterparts. In light of developments in wireless technologies in the last decade, this paper investigates if (and, to what extent) that assumption is still valid. Capacitive coupling, inductive coupling and radio waves are reviewed. These technologies are compared with each other as well as with wireline technologies based on factors including data rate, energy consumption and occupied area. We survey the current trends and emerging technology and consider how they can be exploited. For an evaluation case we simulate a 3D wireless parallel platform. This model is the basis for our research to test the viability of a concept 3D wireless interconnect network for a massively parallel computer.

AB - To date, in computing technology, wireless connections have not been good choices for connecting processors in a massively parallel system. This is mainly because wireless devices are considered to have both more energy demands and have lower data communication rates compared to their wireline counterparts. In light of developments in wireless technologies in the last decade, this paper investigates if (and, to what extent) that assumption is still valid. Capacitive coupling, inductive coupling and radio waves are reviewed. These technologies are compared with each other as well as with wireline technologies based on factors including data rate, energy consumption and occupied area. We survey the current trends and emerging technology and consider how they can be exploited. For an evaluation case we simulate a 3D wireless parallel platform. This model is the basis for our research to test the viability of a concept 3D wireless interconnect network for a massively parallel computer.

M3 - Paper

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T2 - 2013 International Conference on Selected Topics in. IEEE

Y2 - 19 March 2013

ER -

On advantages and limitations of 3D wireless grids as parallel platforms

Abstract

Conference

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Projects

Cool Computer: Cool Computer

Cite this