On advantages and limitations of 3D wireless grids as parallel platforms

Research output: Contribution to conferencePaper

Author(s)

Department/unit(s)

Conference

Conference2013 International Conference on Selected Topics in. IEEE
CountryCanada
Conference date(s)19/03/13 → …

Publication details

DatePublished - 2013
Number of pages8
Original languageEnglish

Abstract

To date, in computing technology, wireless connections have not been good choices for connecting processors in a massively parallel system. This is mainly because wireless devices are considered to have both more energy demands and have lower data communication rates compared to their wireline counterparts. In light of developments in wireless technologies in the last decade, this paper investigates if (and, to what extent) that assumption is still valid. Capacitive coupling, inductive coupling and radio waves are reviewed. These technologies are compared with each other as well as with wireline technologies based on factors including data rate, energy consumption and occupied area. We survey the current trends and emerging technology and consider how they can be exploited. For an evaluation case we simulate a 3D wireless parallel platform. This model is the basis for our research to test the viability of a concept 3D wireless interconnect network for a massively parallel computer.

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