Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging?

Andy C Marvin; John F Dawson

Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging?

Andy C Marvin, John F Dawson

Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An overview of Board level shielding measurement and the associated difficulties.

Original language	English
Title of host publication	Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe
Publisher	IEEE
Number of pages	17
Publication status	Accepted/In press - 15 Feb 2021
Event	2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe - Online Duration: 26 Jul 2021 → 20 Aug 2021 https://www.emc2021.emcss.org/

Conference

Conference	2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe
Period	26/07/21 → 20/08/21
Internet address	https://www.emc2021.emcss.org/

Bibliographical note

Accepted Feb 2021, Final submission 30 May 2021

Access to Document

2_CharacterizingBLS_V06ACMLicence: CC BY-SA

1 Working group

IEEE Standards Association (External organisation)
Dawson, J. F. (Member)
16 May 2016 → 31 Dec 2023
Activity: Membership › Working group

Cite this

Marvin, A. C., & Dawson, J. F. (Accepted/In press). Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging? In Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe IEEE.

Marvin, Andy C ; Dawson, John F. / Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding : What makes characterizing the SE of Board Levels Shields so challenging?. Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe. IEEE, 2021.

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title = "Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging?",

abstract = "An overview of Board level shielding measurement and the associated difficulties.",

author = "Marvin, {Andy C} and Dawson, {John F}",

note = "Accepted Feb 2021, Final submission 30 May 2021; 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe ; Conference date: 26-07-2021 Through 20-08-2021",

year = "2021",

month = feb,

day = "15",

language = "English",

booktitle = "Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe",

publisher = "IEEE",

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url = "https://www.emc2021.emcss.org/",

}

Marvin, AC & Dawson, JF 2021, Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging? in Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe. IEEE, 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe, 26/07/21.

Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging? / Marvin, Andy C ; Dawson, John F.
Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe. IEEE, 2021.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding

T2 - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe

AU - Marvin, Andy C

AU - Dawson, John F

N1 - Accepted Feb 2021, Final submission 30 May 2021

PY - 2021/2/15

Y1 - 2021/2/15

N2 - An overview of Board level shielding measurement and the associated difficulties.

AB - An overview of Board level shielding measurement and the associated difficulties.

M3 - Conference contribution

BT - Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe

PB - IEEE

Y2 - 26 July 2021 through 20 August 2021

ER -

Marvin AC , Dawson JF. Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging? In Proceedings of the 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe. IEEE. 2021

Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: What makes characterizing the SE of Board Levels Shields so challenging?

Abstract

Conference

Bibliographical note

Access to Document

Activities

IEEE Standards Association (External organisation)

Cite this