Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: Round Robin Overview

Davy Pissoort; John F Dawson

Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: Round Robin Overview

Davy Pissoort, John F Dawson

Electronic Engineering

Research output: Contribution to conference › Paper

Abstract

Results from a round robin measurement of board level shielding

Original language	English
Number of pages	14
Publication status	Published - 15 Feb 2021
Event	2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe - Online Duration: 26 Jul 2021 → 20 Aug 2021 https://www.emc2021.emcss.org/

Conference

Conference	2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe
Period	26/07/21 → 20/08/21
Internet address	https://www.emc2021.emcss.org/

Bibliographical note

Accepted Feb 2021, Final submission 30 May 2021

1 Working group

IEEE Standards Association (External organisation)
John Frederick Dawson (Member)
16 May 2016 → 31 Dec 2023
Activity: Membership › Working group

Cite this

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title = "Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: Round Robin Overview",

abstract = "Results from a round robin measurement of board level shielding",

author = "Davy Pissoort and Dawson, {John F}",

note = "Accepted Feb 2021, Final submission 30 May 2021; 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe ; Conference date: 26-07-2021 Through 20-08-2021",

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month = feb,

day = "15",

language = "English",

url = "https://www.emc2021.emcss.org/",

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Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: Round Robin Overview. / Pissoort, Davy; Dawson, John F.
2021. Paper presented at 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe.

Research output: Contribution to conference › Paper

TY - CONF

T1 - Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: Round Robin Overview

AU - Pissoort, Davy

AU - Dawson, John F

N1 - Accepted Feb 2021, Final submission 30 May 2021

PY - 2021/2/15

Y1 - 2021/2/15

N2 - Results from a round robin measurement of board level shielding

AB - Results from a round robin measurement of board level shielding

M3 - Paper

T2 - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal \& Power Integrity and EMC Europe

Y2 - 26 July 2021 through 20 August 2021

ER -

Overview of the P2716~WG - IEEE Guide for the Characterization of the shielding effectiveness of printed circuit board level shielding: Round Robin Overview

Abstract

Conference

Bibliographical note

Activities

IEEE Standards Association (External organisation)

Cite this