TY - JOUR
T1 - Prediction of the Probability of IC Failure and Validation of Stochastic EM-Fields Coupling into PCB Traces Using a Bespoke RF IC Detector
AU - Hunasanahalli Venkateshaiah, Arunkumar
AU - Dawson, John F.
AU - Trefzer, Martin A.
AU - Xie, Haiyan
AU - Bale, Simon J.
AU - Marvin, Andrew C.
AU - Robinson, Martin P.
N1 - © 2025 by the authors
PY - 2025/5/28
Y1 - 2025/5/28
N2 - In this paper, a method of estimating the probability of susceptibility of a component on a circuit board to electromagnetic interference (EMI) is presented. The integrated circuit electromagnetic compatibility (IC EMC) standard IEC 62132-4 enables the assessment of the susceptibility of an IC by determining the forward power incident on each pin required to induce a malfunction. Although we focus on IC susceptibility, the method might be applied to other components and sub-circuits where the same information is known. Building upon a previously established numerical model capable of estimating the average coupled forward power at the end of a trace of a lossless PCB trace for a known load in a reverberant environment, this paper updates the model by incorporating PCB losses and utilizes the updated model to estimate the distribution of coupled forward power at the package pin over a number of boundary conditions in a reverberant field. Thus, the probability of failure can be predicted from the known component susceptibility level, the length, transmission line parameters, and the loading of the track to which it is attached. To validate this numerical model, the paper includes measurements obtained with a custom-designed RF IC detector, created for the purpose of measuring RF power coupled into the package pin via test PCB tracks.
AB - In this paper, a method of estimating the probability of susceptibility of a component on a circuit board to electromagnetic interference (EMI) is presented. The integrated circuit electromagnetic compatibility (IC EMC) standard IEC 62132-4 enables the assessment of the susceptibility of an IC by determining the forward power incident on each pin required to induce a malfunction. Although we focus on IC susceptibility, the method might be applied to other components and sub-circuits where the same information is known. Building upon a previously established numerical model capable of estimating the average coupled forward power at the end of a trace of a lossless PCB trace for a known load in a reverberant environment, this paper updates the model by incorporating PCB losses and utilizes the updated model to estimate the distribution of coupled forward power at the package pin over a number of boundary conditions in a reverberant field. Thus, the probability of failure can be predicted from the known component susceptibility level, the length, transmission line parameters, and the loading of the track to which it is attached. To validate this numerical model, the paper includes measurements obtained with a custom-designed RF IC detector, created for the purpose of measuring RF power coupled into the package pin via test PCB tracks.
U2 - 10.3390/electronics14112187
DO - 10.3390/electronics14112187
M3 - Article
SN - 2079-9292
VL - 14
JO - Electronics
JF - Electronics
IS - 11
M1 - 2187
ER -