Selective Surface Metallization of Single Crystal Silicon Nanowires via Stencil Lithography

B. Ali*, M. Karimzadehkhouei, M. N. Esfahani, Y. Leblebici, B. E. Alaca

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Surface metallization of Silicon Nanowires (Si NWs) is a critical preparation technology for surface functionalization in biochemical sensing applications. Conventional metallization approaches rely on resist lift-off or non-selective protocols, which can lead to contamination and device damage. This work demonstrates a selective and resist-free surface metallization of suspended Si NW in a 3D device architecture via gold stencil lithography (SL). The approach involves control of the stencil-device gap via a thickness-controlled spacer, fabricated onto the stencil, to characterize and minimize geometrical blurring. The approach also prevents potential stencil-device contact-induced damage to suspended Si NW during SL. A significant improvement in spatial resolution for selective metallization onto NW is achieved compared to the state-of-the-art. Additionally, using the proposed approach with spacer thickness control, miniaturization of the stencil aperture dimensions to nanoscale raises the potential for selective metallization of Si NW down to sub-1 μ m in-plane spatial resolution for highly sensitive biochemical sensor applications.

Original languageEnglish
Title of host publication2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Electronic)9798350335460
Publication statusPublished - 12 Dec 2023
Event18th IEEE Nanotechnology Materials and Devices Conference, NMDC 2023 - Paestum, Italy
Duration: 22 Oct 202325 Oct 2023

Publication series

Name2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023


Conference18th IEEE Nanotechnology Materials and Devices Conference, NMDC 2023

Bibliographical note

Funding Information:
*Research supported by TUBITAK under grant numbers 118C155 and 120E347.

Publisher Copyright:
© 2023 IEEE.

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