Silicon-based 3D all-solid-state micro-supercapacitor with superior performance

TY - JOUR

T1 - Silicon-based 3D all-solid-state micro-supercapacitor with superior performance

AU - Wang, Yurong

AU - Sun, Leimeng

AU - Xiao, Dongyang

AU - Du, Huanhuan

AU - Yang, Zhenting

AU - Wang, Xinghui

AU - Tu, Liangcheng

AU - Zhao, Chun

AU - Hu, Fangjing

AU - Lu, Bingan

N1 - Funding Information: This work was partially supported by the National Natural Science Foundation of China (Grant Nos. 51902112, 51922038, 51672078, 61801185, 11704071, and 21473052) and the Hunan Outstanding Youth Talents (No. 2019JJ20005). Publisher Copyright: © 2020 American Chemical Society

PY - 2020/9/9

Y1 - 2020/9/9

N2 - The large-scale fabrication of high-performance on-chip micro-supercapacitors (MSCs) is the footstone for the development of next-generation miniaturized electronic devices. In practical applications, however, MSCs may suffer from a low areal energy density as well as a complicated fabrication strategy that is incompatible with semiconductor processing technology. Herein, we propose a scalable fabrication strategy for the realization of a silicon-based three-dimensional (3D) all-solid-state MSC via the combination of semiconductor-based electrode processing, chemical vapor deposition, and hydrothermal growth. The individual Si/C/MnO2 electrode shows a maximum specific capacitance of 223.74 mF cm−2, while the symmetric electrodes present a maximum areal energy density of 5.01 μWh cm−2 at the scan rate of 1 mV s−1. The full 3D Si/C/MnO2 MSC delivers a high energy density of 2.62 μWh cm−2, at a power density of 117.82 μW cm−2, as well as a long cycle life with capacitance retention >92% after 4000 cycles. Our proposed method enables the fabrication of 3D MSCs based on a thick silicon interdigitated electrode array, holding a great promise for the development of 3D on-chip microscale energy storage devices.

AB - The large-scale fabrication of high-performance on-chip micro-supercapacitors (MSCs) is the footstone for the development of next-generation miniaturized electronic devices. In practical applications, however, MSCs may suffer from a low areal energy density as well as a complicated fabrication strategy that is incompatible with semiconductor processing technology. Herein, we propose a scalable fabrication strategy for the realization of a silicon-based three-dimensional (3D) all-solid-state MSC via the combination of semiconductor-based electrode processing, chemical vapor deposition, and hydrothermal growth. The individual Si/C/MnO2 electrode shows a maximum specific capacitance of 223.74 mF cm−2, while the symmetric electrodes present a maximum areal energy density of 5.01 μWh cm−2 at the scan rate of 1 mV s−1. The full 3D Si/C/MnO2 MSC delivers a high energy density of 2.62 μWh cm−2, at a power density of 117.82 μW cm−2, as well as a long cycle life with capacitance retention >92% after 4000 cycles. Our proposed method enables the fabrication of 3D MSCs based on a thick silicon interdigitated electrode array, holding a great promise for the development of 3D on-chip microscale energy storage devices.

KW - AC filter

KW - All-solid-state

KW - Deep reactive ion etching

KW - Micro-supercapacitor

KW - On-chip device

UR - http://www.scopus.com/inward/record.url?scp=85092681391&partnerID=8YFLogxK

U2 - 10.1021/acsami.0c14441

DO - 10.1021/acsami.0c14441

M3 - Article

C2 - 32902954

AN - SCOPUS:85092681391

SN - 1944-8244

VL - 12

SP - 43864

EP - 43875

JO - ACS Applied Materials and Interfaces

JF - ACS Applied Materials and Interfaces

IS - 39

ER -