The role of the growth temperature for the SiN interlayer deposition in GaN

T. Bottcher, J. Dennemarck, R. Kroger, S. Figge, D. Hommel

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

The application of SiN interlayers in GaN-based structures for the annihilation of threading dislocations captivates by its simplicity and the possibility to use it. However, since the metalorganic vapor phase epitaxy (MOVPE) of the group-III nitrides happens in a hydrogen-containing atmosphere, the surface decomposes during the SiN deposition. This work addresses the impact of the SiN growth with respect to temperature and surface dose. In particular, a quantitative analysis of the surface coverage is presented and the successive overgrowth with GaN is discussed in view of threading dislocation density and island growth mode. (C) 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Original languageUndefined/Unknown
Title of host publication5th International Conference on Nitride Semiconductors
EditorsM. Stutzmann
Pages2039-2042
Number of pages4
DOIs
Publication statusPublished - 2003

Publication series

NamePhysica Status Solidi C-Current Topics in Solid State Physics

Bibliographical note

Times Cited: 7 ICNS-5 5th International Conference on Nitride Semiconductors (ICNS-5) MAY 25-30, 2003 NARA, JAPAN Japan Soc Appl Phys; Japan Soc Promot Sci, 162nd Comm Wide Bandgap Semiconductor Photon & Elect Devices; Japan Assoc Crystal Growth; Elect Soc

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